September 20, 2011 to 22, Bondway (Dongguan) Electronic Material Technology Co., Ltd. in Dongguan Exhibition Exhibitor 12th Dongguan electric Fair, Booth: 6D04. The company will exhibit newly developed adhesive Microelectronics (SMT patch of plastic, underfill, COB encapsulants, silicone adhesives, etc.), customers can enhance competitiveness and create value.